SMBB Technology: Better light trapping and current collection to improve module power output and reliability.
Enhanced Mechanical Load: Certified to withstand: wind load (2400 Pascal) and snow load (5400 Pascal).
PID Resistance: Excellent Anti-PID performance guarantee via optimized mass-production process and materials control.
Hot 2.0 Technology: The N-type module with Hot 2.0 technology has better reliability and lower LID/LETID.
Durability Against Extreme Environmental Conditions: High salt mist and ammonia resistance.